Modal and PSD analysis of Electronic Packaging in Aircraft

Engineering

Electronic packaging units in aircrafts, military vehicles, automotive, automated machinery etc are continuously exposed to severe vibrations such as random, shock and harmonic loads in operation. These electronic units are expected to function uninterrupted under these conditions and hence require to be designed for structural strength and integrity and therefore need to be analysed for the vibration loads to determine the resonance margin, fatigue life etc.

 

Electronic Packaging – Proximity Sensor Electronic unit in Aircrafts

 

 

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